Used BRIGHTLUX DB 382M #9257853 for sale

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Manufacturer
BRIGHTLUX
Model
DB 382M
ID: 9257853
Vintage: 2014
Die bonder 2014 vintage.
BRIGHTLUX DB 382M is an advanced thermally enhanced bonding machine created to improve the performance and accuracy of product joining operations. It is designed for use in fast production and continuous assembly lines, providing efficient and consistent multi-point bonding with minimal manual intervention. DB 382M is equipped with a high-power, thermally activated motor. This allows for excellent thermal transfer, providing the high temperature accuracy necessary to perform repeatable, high-quality bonding operations. The machine is capable of precise thermal control for all types of thermally activated tapes, as well as a wide range of exotic thermally activated materials. This makes it a suitable choice for a wide variety of bonding applications. The machine is also equipped with a high precision, two-stage drive mechanism. This allows the machine to produce exact bond points along the width and length of the product, further contributing to the quality and consistency of the product. In addition to its high-quality bonding results, BRIGHTLUX DB 382M also offers a number of safety features and standard safety mechanisms. The machine is equipped with updated safety equipment, such as anti-collision and emergency stop. It also features a low noise level technique, allowing for a comfortable working environment. DB 382M is also a highly efficient system. It includes a series of constantly updated motion control technology, including ideal relative tolerance, high repeatability and superior speed and accuracy. This allows for rapid bonding of multiple products in a single operation, saving both time and money. In conclusion, BRIGHTLUX DB 382M is an advanced, thermally enhanced bonding machine designed to provide excellent quality results for a variety of bonding applications. It is a reliable system equipped with advanced features, providing a variety of safety features and high accuracy bonding processes. The system is also highly efficient, helping to reduce the cost and time involved in the bonding process.
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