Used CETEK Hawk-1000M #293706255 for sale

CETEK Hawk-1000M is a thermocompression wire bonder that is used in advanced microelectronics production processes. It is capable of attaching metal wires to a variety of substrates such as ceramic, metal, or plastic. Hawk-1000M uses ultrasonic frequencies to make the metal wire bonds, creating a strong, secure connection. The wire diameter range is 0.15-0.80mm, allowing for a wide range of applications. CETEK Hawk-1000M features advanced high speed algorithm control software and system performance monitoring to ensure high accuracy and reliability. It has an adjustable bonding area, allowing for multiple tool configurations for special microelectronic applications. Its advanced direct drive motor system provides precise movements and positioning with a controlled frequency, allowing a range of bonding speeds from 0.2-3.0cm/sec. Hawk-1000M also features an integrated 3D stereoscopic microscope that makes it possible to inspect the bond data in great detail. CETEK Hawk-1000M has built-in safety features, such as a pressure and temperature monitoring system, to ensure all mechanical settings are proper and within safety requirements. The machine is equipped with a quick-disconnect wire guide, bonded foil catalyst and pre-bonder clamp to ensure efficient and easy operations. The bonder is also available in a heavy duty model that provides a more robust build and higher working speeds. Hawk-1000M is a powerful thermocompression wire bonder that provides excellent accuracy and reliability. It is an ideal machine for advanced microelectronics production processes and offers users the ability to quickly and accurately make metal wire bonds. The advanced features and safety functions make CETEK Hawk-1000M a safe, reliable, and powerful bonder for all microelectronics production needs.