Used DAGE 22 MICROPULL #159028 for sale

DAGE 22 MICROPULL is a fully automated, high precision die bonder designed for micro-electronic and opto-electronic die attach applications. The unit is suitable for a wide range of state-of-the-art components from 0402 up to chip scale packages with dimensions of 1 x 1 and 0.5 x 0.5mm, including direct die attach and eutectic and epoxy attach processes. The MICROPULL is a precision instrument, capable of extremely accurate alignment, placement and bonding of dies and substrates on a standard pitch range from 0.5 to 5mm. Additionally, its speedy process cycle time of only 0.5 second, in combination with its high repeatability and quality assurance capabilities, makes it one of the fastest, most efficient die bonders on the market. The MICROPULL also features an outline finder, an integral part of the unit, which takes optical photographs of the outline of the die or package, which aids with correct alignment and placement. Once an outline is located, the machine is automatically aligned and ready to bond the device. Its non-contact 42-axis displacement features a feed device that achieves a placement accuracy of ±25um (2σ). The MICROPULL is designed to bond thin, fragile devices without damaging their delicate components. It employs a precision air-actuated "micropush" bonding headhich detects the height of the die, and adjusts its force vector in order to deliver the optimum amount of force during die attach. This ensures that the sensitive elements of the device remain undamaged during the bonding process. Furthermore, its advanced software and control system allows for easy programming and operation. It is capable of controlling product temperature in real time and can be remotely monitored and supported. It also has an integrated vision system that can be used for visual inspection for ensuring product quality and reliability. 22 MICROPULL is a reliable, efficient, and productive die bonder perfect for a wide range of micro-electronic and opto-electronic applications. Its combination of features, such as precision automated alignment, fast cycle time, accurate bonding process, and programmable control system, make it one of the best and most advanced die bonders on the market.