Used DAGE 2400 PC #140838 for sale

DAGE 2400 PC is a precision ball-bonding system popularly used in the assembly of microelectronics in the semiconductor industry. This system is equipped with a floating heated bondhead and microprocessor-controlled ball-weld and ball-form processes that ensure consistent and repeatable weld and form operations. This bonder also offers the operator a choice of two control modes: bead height wafer-level control and manual speed with manual absolute and relative height control. DAGE 2400PC utilizes a tensioned tungsten or palladium wire to provide a strong and reliable weld. This wire is fed through either a "direct" or "dynamic" bonding head. The direct head is capable of achieving a "tight" bond loop due to its relatively small size, while the dynamic head provides an electronically-controlled and more versatile bond loop size. Both the direct and dynamic heads have been tested to achieve bond forces up to 125gF. In addition to precision welding and forming capabilities, 2400 PC also has a range of useful features including automatic fiberoptic centering, an adjustable motion controller, and a pneumatically controlled vacuum chuck. The adjustable motion controller makes it possible to make incremental changes to the welding current and speed during an operation. This is particularly useful in environments where the process needs to be tweaked in order to achieve optimal results. The Vacuum chuck enables the bonder to hold up to four dies at a time, helping to make efficient use of time and resources. This chuck is mounted on the bond head in order to ensure the stability of the wire during bonding operations. The bonder is also equipped with a quickly exchangeable head, making quick work of occasional repair work or product change-over. Overall, 2400PC is a reliable and powerful precision ball-bonding system that offers reliable performance and repeatability. With a selection of dynamic and direct heads, adjustable motion controller, and an autofocus feature, it is an ideal choice for microelectronic components assembly and other ball-bonding related operations.