Used DAGE 2400 PC #58694 for sale
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ID: 58694
Shear / Pull Tester
Power Requirements: 110-120 VAC @ 5 A, 220-240 VAC @ 3.15 A
Dage BT2400PC Application 1997
Windows 98
Fully configured tower style machine control computer
Supplied with a manually adjustable X-axis table.
This unit is a multi-function, semi-automatic test facility, offering extremely versatile destructive and non-destructive testing (NDT) or ball-bonds, and wire pull
Features:
Pentium motherboard installed versus standard EPROM board configuration
Windows 95 software interfaced to system hardware by motion control card
PC Monitor used versus typical LED-type display
Automatic Calibration and Linearity Checks
Advanced Load Cartridge Design
Mouse-driven operation for machine set-up, control and analysis operations
Floppy and hard drives include for introduction and storage of test configurations and results
Comprehensive range of analysis screens and test result files allow data analysis directly on the PC2400T. Information can be printed using standard Windows print options.
Results are automatically stored on the hard disk in CSV text file format and can be exported to floppy disk, RS232 port or directly to a factory mainframe via a network.
Quick release design ensures that change-over time between test functions is minimized
Applications include:
Ball shear
Aluminum wedge shear
Low force die shear
The system caters for these types of bond test using up to 5 kg force
Die shear using up to 100 kg force
Wire-pull testing using up to 10 kg force
Software/Configuration Versions:
Main Control: 2.39d
Motion Config: 2.3612
Motion Program: 2.381
Motion Board: D841 Issue 4
Cartridge included (Choice of one):
Model Number: 2400PC-BS5KG Ball Shear Cartridge for 5k grams
Model Number: 2400PC-WP100 Wire-Pull Cartridge for 100 grams
Specifications:
Z Axis Travel: 2.87"
Work Holder:
X Axis Travel: 1.0" manual adjustment, 0.9" motorized adjustment
Y Axis Travel: 0.9"
Maximum Test Force:
Z Axis: 10 kg
Y Axis: 100 kg
Minimum Detectable Load (From Software Version 2.20):
5% of currently selected test load range
(For destructive testing - 5% of the threshold parameter slider setting)
Work Area (Swing Round Tool): 8.5" minimum
Keypad: 4 x 4 matrix
Joystick: Self centering
Illumination: 20W Halogen lamp
Vacuum Base: 20" Hg minimum (supply to machine)
Sound Level:
Continuous A-weighted sound pressure at the workstation < 70 dB(A)
Die Shear Testing Specifications:
Measurement Accuracy: +/-0.5% of load cell rating
Test Mode: Destructive or Non-Destructive
Shear Mode: Automatic
Shear Direction: Y axis, front to back
Shear Tool (Standard): Tungsten carbide
Landing Speed (Programmable): 0 to 0.039" / s
Landing Force: 3g to 10g (depending on landing speed)
Shear Height:
Range: 0 to 0.019"
Resolution: 0.00025 mm
Accuracy (At Start of Test): +/-0.00025 mm
Accuracy (Though Test): +/-0.0005 mm
Shear Speed (Programmable Range): Cartridge dependent
Y Axis Travel During Shear Test: Cartridge dependent
Ball Shear Testing Specifications:
Measurement Accuracy: ±0.5% of load cell rating
Test Mode: Destructive or Non-Destructive
Shear Mode: Automatic
Shear Direction: Y axis, front to back
Shear Tool (Standard): Tungsten carbide
Landing Speed (Programmable): 0 to 0.039" / s
Landing Force: 3g to 10g (depending on landing speed)
Shear Height:
Range: 0 to 0.5 mm (0.019")
Resolution: 0.001 mm
Accuracy (At Start of Test): ±0.00025 mm
Accuracy (Through Test): ±0.0005 mm
Shear Speed (Programmable Range): Cartridge dependent
Y Axis Travel During Shear Test: Cartridge dependent
Pull Testing Specifications:
Measurement Accuracy: ±0.5% of load cell rating
Test Mode: Destructive or Non-Destructive
Pull Mode: Manual, Step back, or Autohook
Pull Direction: Z axis, vertical
Z Axis Stroke: 73 mm
Pull Tool (Standard): Hook or tweezer
Pull Speed (Programmable):
Range (up to 1kg rating): up to 5.0 mm/s
NDT Overshoot: 0.5% FSD.
DAGE 2400 PC is a precision ball and wedge bonder used widely in the semiconductor industry. It is capable of performing fine pitch and wire wedge bonding, as well as precise thermocompression welding. The equipment is capable of producing a wide range of bond sizes, with a maximum wire size of 0.0025 inches (25 μm). It is compatible with both copper and gold bond wires, allowing for the use of either material. The system's electronic settings can be adjusted easily, allowing the user to customize parameters such as bond time and current settings. DAGE 2400PC is also equipped with an Anti-Tilt Unit to reduce the chance of wire distortion during the bonding process. The machine is designed for use with a wide range of substrates. It is equipped with contact position sensors to ensure optimal alignment of components during the wire bond process. To further improve accuracy, the tool is equipped with a CCD camera, which can be used to precisely measure the bond and inspect it for reliability and quality. For operators, 2400 PC functions mainly through touch screen display. This allows the user to easily access a variety of options, including adjusting program settings, viewing bonding parameters and information regarding components, and operating the bonder. 2400PC also includes an alarm asset that can alert the user if a bonding error has occurred. This allows corrective action to be taken to prevent any further disruption to the operation. Also included is an auto-chuck model, which automates the process of picking up, positioning and ejecting components. This reduces cycle time and improves the overall output of the bonder. DAGE 2400 PC is a reliable, versatile and precise bonder. It can be used for a wide variety of tasks and is capable of producing reliable and consistent results. Its ease of use and ability to customize settings make it a great choice for semiconductor production.
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