Used DAGE 2400 PC #9196390 for sale

DAGE 2400 PC is a high performance ball and wedge wire bonder from DAGE Precision Industries. It is designed for high speed, precision bonding of semiconductor and discreet components. DAGE 2400PC is ideal for the assembly and repair of surface mount, printed circuit and other components that require precise and reliable bonding. 2400 PC has a fully programmable aerospace-grade micros immersion controller which has multiple operation modes to allow for multiple steps within the bonding process. It also has a 14-inch wide X-Y motion platform that offers an optimal working distance and angular range for exceptional maneuverability and position accuracy. The integrated conveyor system guarantees accurate alignment from component to component and is adjustable to accommodate various lengths of parts. Other features of 2400PC include a powerful bonder with an adjustable bonding force up to 400 grams per square centimeter, a large selection of bond heads to cover a range of bonding requirements, and a quick dial-in for the required bond parameters. The dual half-bridge (H-bridge) rotor assembly ensures superior control, delivering consistent and uniform bonds. DAGE 2400 PC also features a programmable dual ultrafine linear bearing system for unequaled accuracy in placement of bond feathers. DAGE 2400PC also has a user-friendly interface which allows for quick setup and reprogramming of the bonding parameters. It also has an intuitive graphical display which allows the user to easily monitor the bonding process. This machine is well suited for high-volume CMOS, CSP, BGA and flip chip bonding operations. 2400 PC is designed to operate in various production environments, ranging from low to high production volume. Its proven versatility and reliability make it a suitable choice for manufacturers and assemblers needing secure connections and high performance for their sensitive applications, including automotive, aerospace, medical, legal and high-end consumer electronics products.