Used DAGE 2400 PC #9259907 for sale

DAGE 2400 is a high-end, high-performance bonder specifically designed for automated precision and reliability in wire bonding operations. DAGE 2400 is well suited for a wide range of production applications requiring precision bonding including: gold and copper wire bonding, ball bonding and wedge bonding. DAGE 2400 is particularly suited to gold and copper wire bonding operations and is one of the most reliable and flexible bonders available for the production of complex and demanding bonded performance applications. It offers a unique combination of high accuracy, control and automation, making it an efficient, reliable and cost-effective bonder choice. DAGE 2400 is a versatile and adaptable production-oriented bonder, offering a variety of configuration and product options catering for a wide range of product designs and production requirements. It features an efficient and effective process control system that is easy to setup and monitor from one touch screen NC control panel, allowing for flexible and efficient operation. It is equipped with four high open-loop looping wheels, enabling the user to adjust each wire individually for accurate and precise operations. DAGE 2400 is an advanced, automated bonder supported by a range of sensors to ensure that the highest precision and reliability levels are achieved when bonding. This bonder also offers a wide range of additional features that ensure consistency in the production process. These include integrated vision systems for wire inspection and bond scanning, automated system diagnostics for fast troubleshooting and setup, and various process-monitoring options such as optical power sensors and optical camera systems for accurate placement and adherence of wires within specified tolerances. DAGE 2400 is a highly reliable bonder and has been tested to have a MTBF of >50,000 hours. It also includes backup maintenance exchange and recovery provisions. DAGE 2400 is CE certified and can accommodate a range of voltages and currents, with the power supply being automatically selected to match the bond cycle requirements. This provides the user with efficient, reliable and flexible performance in production-level bond operations.