Used DAGE 2400 #293644324 for sale

DAGE 2400 is a sophisticated automated bonder designed for use in microelectronic applications. This advanced system is designed for high accuracy and repeatability, offering high speed and precision bonding for both leaded and leadless applications. It is also designed for flexibility, allowing for changes in components and pitch types with minimal tooling and setup time. At its core, 2400 utilizes a Micro Controller Unit (MCU) to provide the accuracy, speed and control necessary to accurately bond the most challenging components. The MCU controls the X, Y and Z-axes of the device, providing precise positioning and motion control. The head of the device houses a precision optic video-centric vision system, which helps the MCU accurately locate and align components for bonding. DAGE 2400 also uses a high precision IR reflow head for heating and melting the solder, providing uniform and reliable results for each bonding operation. 2400 is highly user-configurable, offering a wide range of options to suit any specific application need. The range of heads can be changed to provide different power settings as well as different vision tools and optics. The MCU also offers a variety of programming options, including continuous, on-the-fly, alternate vision, separate X and Y motion, and more. DAGE 2400 offers a wide range of options when it comes to solder paste types, allowing the operator to select the best option for each application. The solder reservoir allows different types of paste to be used and is easily replaced. The paste can also be easily exchanged without the need to proceed with setup and re-tooling. Overall, 2400 is an advanced, user-configurable bonder designed specifically for microelectronic applications. Its wide range of options, high speed, accuracy and repeatability, and flexibility make it an excellent choice for a wide range of applications.