Used DAGE 2400 #293660879 for sale

DAGE 2400
Manufacturer
DAGE
Model
2400
ID: 293660879
Bonder.
DAGE 2400 is a bonder is a machine designed for producing interconnection and passivation of a variety of electronic components that require copper thick-film metallization and thin film hybrid circuit technology. It is a powerful and versatile machine, perfect for a wide range of high-precision electronics manufacturing tasks. 2400 is built on a modular design concept which allows for easy maintenance and upgradeability. The equipment operates under a variety of different modes. It can be used to prepare and adhere metal or ceramic electrodes for surface mount chip components, thermally bond ceramic components, or perform wire bonding. It also features a layer thickness control system that provides extremely tight tolerance capability, ensuring the highest level of accuracy. DAGE 2400 is equipped with a sophisticated thermal control unit. This allows the machine to accurately maintain temperature profiles for delicate thin-film and hybrid circuits. It is capable of performing a range of temperature control capabilities including preheating, soldering, descum, vacuum, bonding, and cool-down. Its temperature control tool also ensures an even application of adhesive or epoxy on components, thus improving bonding quality. 2400's design also eliminates many of the variables from traditional bonding processes. Asset parameters such as power, speed, and residence are all adjustable and stored in the model's memory. This eliminates errors that can arise from manual adjustments during the process. DAGE 2400 is designed to perform a wide range of bonding operations with high precision. With its integrated control equipment and superior temperature control, the system is capable of producing superior results with low scrap rates. In addition, its modular design provides flexibility in production with easy upgradeability, allowing for increased productivity. Overall, 2400 is a powerful and versatile machine, perfect for a variety of high-precision bonding operations.
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