Used DAGE 2400 #67380 for sale

DAGE 2400 is a precision wafer bonder designed to meet stringent process requirements in the semiconductor, MEMS, and optoelectronic industries. It is a highly versatile equipment that offers rapid and reliable production with a large bondable area of up to 305mm x 305mm. 2400 provides high accuracy and repeatability for critical applications such as flip chip, chip-on-chip, die-level optics, and high resolution die attach. The system's versatile bonding process capabilities include heated and cold thermal compression, thermosonic, wedge, and ultrasonic technology. Unlike many competitive bonders, DAGE 2400 is capable of producing a wide range of bond heights and can easily accommodate different die sizes and structures. The unit employs advanced vision machine technologies to identify, inspect and align the die joints prior to bonding. In addition, a high speed auto-indexer allows for increased throughput and enables real-time, non-destructive bond quality testing. 2400 is highly customizable and can be configured specifically for various production needs and requirements. It offers an intuitive, highly stable user interface that makes alignment repeatability and application-specific parameters easy to adjust. An array of standard and optional accessories, including a range of available bond heads, also allows for maximum versatility. DAGE 2400 tool can easily integrate into a variety of production lines and is well suited for high volume production and prototyping applications. The advanced engineering and design of 2400 ensures robust and reliable operation. The asset is constructed of rigid structural components and is designed to guarantee superior technical stability. The entire frame is designed to ensure minimum deflection due to external disturbances and the accuracy is further enhanced by the use of direct drive motorized stages. Furthermore, the model is equipped with advanced diagnostics and a highly stable thermal control equipment that provides precise and repeatable temperature control of the bonding element over long time frames. DAGE 2400 is a highly precise and powerful wafer bonder that is designed to provide the utmost in terms of consistency, accuracy, and stability. It offers a multitude of process capabilities and versatility, allowing it to be used in a wide variety of applications. The system is capable of bonding a range of die sizes and structures, is easily integrated into a variety of production lines, and is well suited for high volume production and prototyping applications.