Used DAGE 2400 #9093803 for sale

DAGE 2400 bonder is a high-precision, versatile, and easy-to-use bonder manufactured by DAGE. This advanced bonding equipment is ideal for a wide variety of applications, from fine wire bonding to ultrafine ultra-low-profile die attach. 2400 bonder features an ergonomic design for ease of use, an intuitive touchscreen user interface, and a variety of features to ensure the highest bonding accuracy. The bonder has a long working life, and a wide range of components to meet the needs of a variety of applications. In addition to the work area, the bonder includes a range of options for flexibility and performance with a number of integrated features. It has four motorized fine-stepping drive axes with high resolution encoder feedback for precise and accurate positioning. The system also includes advanced vision capability for Image Position Detection (IPD), and an optional advanced camera unit is available for bonder position verification and component verification. For flexibility and performance, the bonder offers an array of options, such as an industry-leading bond head with microwelds for gold and copper wires, as well as a wide selection of vacuum cups for die attach. The capability of the bonder can be further augmented with optional module and tooling packages. The bonder also packs a punch in the control machine department with a powerful embedded controller for real-time feedback and control, allowing for faster cycle times and more reliable bond performance. A self-test feature reduces downtime by enabling technicians to ensure the bonder is in proper working condition prior to use. Overall, DAGE 2400 bonder is a highly reliable and versatile manufacturing solution for a wide variety of applications. It offers exceptional performance, precision, and flexibility for a variety of tasks, from fine wire and ultra-low-profile die attach to leadframe and ribbon bonding. The intuitive touchscreen user interface and self-test feature make it a cost-effective and reliable solution for precision bonding applications.