Used DAGE 2400 #9144827 for sale

DAGE 2400
Manufacturer
DAGE
Model
2400
ID: 9144827
Wire pull tester.
DAGE 2400 is an automated, high-precision, media-handling, fully-automated bonder. It is an ideal solution for fast production and cost-effective bonding of all types of substrates. The equipment is micro-dispense enabled and has a unique indexing station for rapid die placement. 2400 is suitable for a wide range of substrates including rigid and flexible materials such as PCBs and glass, employing an array of bonding technologies to ensure superior performance standards. It is capable of creating bonds with exceptional cycle times, enabling the manufacture of a wide range of electronics, including cell phones, communication devices, automotive systems, MEMS devices, and printed circuit boards. The system features an integrated three-axis linearite motion controller, allowing highly accurate die placement and optimization of the bond process. The linearite unit is driven by the machine's proprietary control software which ensures precise and repeatable control of the components' motion. It is capable of high-precision positioning and features a vision tool for accurate relocation and verification. The asset has a powerful industrial Windows-based control software for die-to-die automation and robot control. It is the industry's first four-axes bonder that triggers vision and robot pick and place commands. The model is also equipped with a die/component database which enables complete management of inventory and helps to maximize yields. DAGE 2400 is incredibly user-friendly, with an intuitive, graphical user interface, as well as a library of pre-programmed die placement routines. It also features an extensive array of parameter settings, providing for an easy and comprehensive fine-tuning of the bond routines associated with different components. Additionally, the equipment is equipped with an advanced wafer turner for in-line wafer processing, enabling quick and efficient production. Overall, 2400 is an advanced, high-precision bonder that enables consistent automation and control stanards. It is ideal for a range of substrates and industries, and features an array of unique capabilities, making it a high-performance and cost-effective solution.
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