Used DAGE 2400A #293627276 for sale

DAGE 2400A is a bonder specifically designed for microelectronics applications that require precision alignment and accurate bonds. This bonder features a range of features for automated high-throughput production including AutoScan and Active Height Adjustment. It allows for accurate alignment, higher bonds and precise shaping of bond pads and wires, making it ideal for fine pitch and pitch-less bonding applications. 2400A utilizes an automated eutectic die bonding process to deliver reliable bonds, precise pitch and pitch-less wire bonds, as well as ultra-fine pitch wire bonds with <1 mil (<25µm) accuracy, eliminating the need for manual trimming. It is equipped with a high temperature oven for curing eutectic and non-eutectic bonding materials, allowing for higher reflow temperature applications. The bonder also features advanced safety features to ensure the safety of the operator and environment. It has two standby modes: programmed shut-off and manual shut-off, which prevent the bonder from working beyond specified parameters, as well as data logging that monitors all parameters and outputs during the bonding process. DAGE 2400A has a compact design and programmable parameter selections, and is compatible with various bonding materials and precision needles. It has an accuracy of +/- 0.2 mil and scanning accuracy up to 0.15 mil, which provides the highest repeatability and highest throughput rates. The bonder also has an intuitive, user-friendly interface and modularization to equip users with the ability to upgrade the system when technology advances. 2400A is designed for high-throughput, repeatable microelectronic bonds, providing a powerful solution for advanced packaging and microsystem assembly.