Used DAGE 2400A #9072226 for sale

DAGE 2400A is a fully automated wedged and ball-wire thermosonic gold and gold alloy bonding machine. This system provides high accuracy and repeatability along with quick setup times and high production speeds. Capable of connecting complex bonded assemblies such as multi-chip modules, wafer level packages, chip-on-glass, LED's, and optoelectronic components. DAGE 2400 A consists of three main components: the bonding head, the process control unit, and the programmy. The user-controlled, non- contact, thermocompression head is capable of withstanding 2N of axial force and is designed to locate and bond each wire on-the-fly. The bonding head contains an integrated wedge and ball wielding option which uses vibration and compressive forces to create an electric bond. Additionally, the head is equipped with a 2D vision system which provides for accurate wire-to-pad registration and the programmy, which automatically controls the movements of the head, can be programmed to ensure that no two wires are energy at the same time. The advanced process controller features a 4-position process selector which allows the user to select from 4 different process recipes. It also contains 8 digital outputs, 4 digital inputs and 1 analog input which allow for connection to a peripheral device. Additionally, it contains advanced algorithms for controlling the various stages of the thermocompression process, as well as advanced monitoring and diagnostics functions to ensure proper bond formation. The programmy, which is programmed using a Windows-based environment, is capable of running up to 16 sequences with up to 72 steps. It also features programmable parameters for optimizing output power and wire speed, as well as a real-time monitor which displays bonded wire quality information. The programmy includes safety features such as auto kill and emergency abort cycles to ensure operator safety and equipment integrity. 2400A is a powerful and reliable bonding machine which provides superior production speeds, cycle times, and accuracy. Its non-contact design ensures that all wires are placed with precision, while its advanced algorithms and programmy features provide an easy and safe operating environment. This system is the perfect choice for high-volume production runs of complex bonded assemblies.