Used DAGE 2400A #9169196 for sale

DAGE 2400A is a state-of-the-art bonder equipment used for fine pitched interconnect circuits and die attach applications. It is designed for advanced bonding applications including wafer level fan out, chip scale packages, flip chip and semiconductor packages. The system is made up of two main parts; the PC based software and the hardware unit. The hardware machine consists of a high resolution Bond Head, an XY robot and a thread frame. The Bond Head provides high precision with +/- 3µm repeatability and up to 50µm accuracy. It also has a high speed bond capability of up to 50 joints per minute and an integrated wire cutter for high performance processes. The XY robot is designed for fast part positioning with up to 120mm/sec travel speed and uses a digital axis control tool for accurate and repeatable movements. Lastly, the thread frame holds the parts in its adjustable clamshell design and provides a compact and flexible platform to meet different kinds of applications. The PC based software is designed for easy and efficient program development with advanced features such as graphical editing, multi-language support, automated process creation and database editing. It also offers a comprehensive suite of analysis and diagnostic tools to monitor process performance, optimize process parameters and ensure optimum bond quality. Overall, DAGE 2400 A is an advanced and fully-integrated bonder asset that can be used for a range of bonding applications from wafer level fan out and chip scale packages to flip chip and semiconductor packages. The high precision and fast bond capabilities along with its easy-to-use software makes 2400A the ultimate tool for precision manufacturing in the global semiconductor industry.