Used DAGE 2400A #9219695 for sale

DAGE 2400A is a state-of-the-art semiconductor bonder designed to deliver exceptional wire and ball bonding performance. This advanced bonder provides precise control of material compression, pre-heat temperature and force during the bonding process. The adjustment of the force applied to the bonding wire is set by the means of a 'force profile' that is programmed into the bonder. This ensures that the solder bonds are optimally controlled and produce reliable results. The equipment also offers the user a range of monitoring features such as real-time temperature tracking and bond force monitoring. The operator can also adjust the stitch count and pitch for the stitch wire bonds using the user-friendly control panel. DAGE 2400 A's ergonomic design provides an intuitive approach to bonding and allows for quick setup and routine maintenance. The 40 micron run point accuracy of 2400A ensures that wires of different diameters can be bonded with precise control. The bonder also offers the user several different ways of providing material control, including the use of an inert gas pressure system as well as multiple force sensing positions. The high speed of the bonder allows for the production of wire bonds at a rate of up to 100grams/second with a cycle time of less than 100 milliseconds. The unit is also capable of producing both gold and aluminum wire bonds with a thickness of up to 150 micron. The all ball drive machine on 2400 A ensures completely reliable wire movement and precise wire looping for consistent performance from bond to bond. To summarize, DAGE 2400A provides superior quality wire bonds as well as reliable results. Its user-friendly control panel, combined with the precise control of material compression, pre-heat temperature and force make it an ideal choice for those looking for reliable, high-quality bonding solutions.