Used DAGE 2400T #9217633 for sale

DAGE 2400T is an automated flip chip bonder used for a variety of electronic assembly processes. This state-of-the-art bonder uses vision-based fine alignment to accurately place devices to 1 μm repeatability onto areas required for the soldering process. In addition to aligning chip devices, 2400T can be used to monitor soldering processes in real-time as well as to determine soldering integrity via post-process X-Ray inspection. In its standard form, the bonder has a flip chip capability of 300 μm pitch with a 14 mm loaded die. It can wire bond a range of die from 2.5 mm x 2.5 mm up to 25 mm x 25 mm with adjustability to be expanded to the limits of the chuck. DAGE 2400T is equipped with a Tri-Linear motion equipment consisting of three linear axes and a high performance image system. These elements work together to provide precise positioning and repeatability of the flip chip devices. The Tri-Linear motion unit is capable of providing 0.5 μm pitch, 0.001 μm resolution, and an X-Y accuracy of less than 1 μm. In addition to this machine, the bonder also has a down camera for image acquisition that guarantees an accuracy of 0.5 μm. Both the Tri-Linear motion and image systems work in conjunction with the software that controls the bonder, allowing for easy setup and operation. 2400T also has a number of additional features that make the bonder more efficient and cost-effective. The chuck used to hold the die can be customized with different sizes and materials, and the setup time can be quickly changed to accommodate a wide variety of projects. Also, an 8-channel BGA Head tool can be added to increase capability. The bonder also includes a Quad Video Asset that allows for network viewing to four different monitors, as well as a Vacuum Chuck Box that offers an increased level of reliability with the added capability of printing out test results from an embedded printer. Overall, DAGE 2400T provides reliable, precise, and accurate alignment and placement. With its high-performance, three-axis motion and image systems, as well as its other customizable capabilities, this bonder offers users the ability to perform efficient and complex assembly processes with ease.