Used DAGE 4000 PA #9315448 for sale

DAGE 4000 PA is an automatic epoxy or acrylic bonded wafer probe equipment designed for use in a variety of semiconductor test and device probing applications. The system utilizes a new optimized automated bonder scan strategy for improved wafer probing throughput, while providing consistently high yield bonds with both epoxy and acrylic materials. The unit consists of three principal modules: the automated bonder, the controller, and the software. The automated bonder consists of a three-axis surface mount robot, a trackside pick-and-place" module, an interconnecting buss machine, a high-speed jetting station, and a "probing bed" feature. The "trackside pick-and-place" module provides a highly accurate positioning of wafer probes relative to wafer sites. With the controller, users can program the bonder to execute a variety of operations that are mirrored in the software, such as wafer presentation, probe alignment, wafer alignment, current application, bond selection, jetting head selection, needle tip selection, and current level selection. The software provides an easy-to-use graphical user interface with a comprehensive set of commands including wafer, probe, bond, and jet selections. DAGE 4000PA is equipped with an intelligent Alignment Imaging Tool (AIS) for rapid wafer probe alignment and a high-speed jetting station for delivering perfectly formed, high-yield, epoxy or acrylic bonds. The asset also features a unique "bond analyzer" feature, which allows users to measure and analyze the bond strength of up to four bonds simultaneously. The wafer probe model is built with an adjustable temperature-controlled bed capable of reaching temperatures up to 60 °C. It also features a low-profile hood design to ensure the highest levels of operator safety during the bonding process. The high-speed jetting station is designed to provide optimal jetting results with perfectly formed bonds in a minimum of time. Overall, 4000 PA is an ideal solution for wafer probe and bonding applications offering excellent repeatability and consistency in wafer probing and bond formation, allowing for fast and reliable wafer probing.