Used DAGE 4000 PAT #293671960 for sale

DAGE 4000 PAT is a bonder designed for use in semiconductor packaging, low-temperature and high-power applications, and active chip attach. It is a multi-purpose tool that is versatile enough to cover a wide range of workloads and product needs. Using the advanced technology of parallel motion, 4000 PAT performs simultaneous bond functions, such as Thermal Compression Bonding (TCB) and die attach, allowing for efficient process operation and shorter cycle times. It also offers a wide range of bond process capabilities, including thermal compression, ultrasonic, thermocompressive, eutectic, and micro-ball bonding. The PAT includes a Peltier and thermoelectric cooling technology, allowing it to handle high-temperature bonds more efficiently. DAGE 4000 PAT is a fully motorized, 5-axis tool. Each of the five axes is highly precise and can be programmed for precise movements to suit the requirements of the application. It also features advanced tool control equipment with an efficient servo-loop control system for maximum precision. The unit is powered by a choice of AC or DC supply voltages. It uses a PC-based GUI for complete process control and monitoring. The machine comes with a variety of optional features, including high vacuum sealing, nitrogen, and air cooling. The instrument comes with an integrated pressure controller, which ensures reliable and repeatable low-force bonding. The intuitive user interface enables operators to efficiently set up and fine-tune the PAT parameters. Additionally, the various components of the instrument can be integrated with a choice of hardware and software options for a comprehensive product offering. 4000 PAT is a robust and reliable tool that offers a reliable and repeatable performance in demanding semiconductor packaging and assembly operations. It offers a range of features and options that meet the demands of diverse applications. With its advanced programmable and flexible motion control, DAGE 4000 PAT provides an optimal solution for efficient and reliable bonding.