Used DAGE 4000 PXY #9046987 for sale

DAGE 4000 PXY is an advanced die bonder that is designed to quickly and efficiently bond a wide range of components to substrates. The bonder utilizes precision PNP motions with industry-leading vision and minimum height adjustment capabilities to speed up the production process. It is designed for high throughput, single-die applications and the ability to process multiple die sizes. It is equipped with a 660mm x 480mm XY table which can move up to 5 meters per second. Its high speeds can process up to 3,000 components per hour. DAGE 4000PXY also features a maximum resolution of 0.25 microns due to its laser power measurement system and high-precision encoders. It also features a patented cooling technology to ensure reliable bonding temperatures. 4000 PXY is powered by Windows 7 and has a PC-based software. This software features an advanced graphical user interface (GUI) and a library of standard programs such as Solder/ Wire Bond and Pin Bond applications. The PXY can process a wide range of wire sizes and provides the ability to accurately control the process parameters. It also has Vision Kalibrators, Heaters and PWMs modules to ensure precise bonding. 4000PXY also has a wide range of integrated sensors and software tools such as temperature and force feedback, smoke detectors, pressure sensing devices and automatic camera calibration system. For accuracy, it has a positioning system and intuitive zoom-in/zoom-out user interface which enable fast die pick up and placement. For added reliability, it can be partially or completely automated with the use of robotic arms and/or other external control systems. It is also capable of post-process inspection and analysis with imaging software, allowing for automated reduction and rejection of faulty products. DAGE 4000 PXY is the perfect tool for high-yield die and wire bonding applications. Its wide range of features and capabilities make it the ideal choice for production lines in the electronics industry.