Used DAGE 4000 PXY #9081078 for sale

DAGE 4000 PXY is a state-of-the-art bonder designed for accurate and precise up-down and side-to-side thermosonic gold ball and wedge bonding of flipchip and wirebond devices on printed circuit boards (PCBs). This advanced equipment is ideal for production environments that require ultra-quality performance with repeatable and reliable results. DAGE 4000PXY boasts an exclusive 'stacked-die flipchip' technology which allows multiple die devices to be mounted to the same substrate, enabling the device to be operated at improved levels of repeatable accuracy. The system is capable of processing up to three die devices in a single bin while maintaining a total space requirement of only 500mm x 250mm (20" x 10"). 4000 PXY is powered by a unique BondVision multi-language software suite, designed to deliver superior process management with high levels of accuracy and ease-of-use. This comprehensive suite is capable of managing a range of processes in both manual and automatic modes, with multi-step bond head control functions such as flipchip sensing, design verification, bondhead positioning, buffing, scrubbing, and cleaning operations. The unit is also equipped with Visionography CCD cameras to ensure precise placement of die devices and accurate gold ball and wedge bonding of various substrates. Additionally, the machine is capable of performing a variety of precision alignment functions, including fiducial, coplanarity, strain gage, LED alignment, and die inspect. In order to ensure the highest quality standards, 4000PXY includes an active Six Sigma quality analysis function which monitors bond process parameters and records performance history including lot traceability. On-board error containment systems can be enabled in order to quickly reduce costs associated with process errors such as poor bonding. Overall, DAGE 4000 PXY is an advanced, cost-effective solution for any production environment that requires high levels of accuracy and repeatability for accurate gold ball and wedge bonding.