Used DAGE 4000 PXY #9090079 for sale

DAGE 4000 PXY is a high-resolution bond tester used for die attach and die bond testing, providing reliable die attach and die bond results. The equipment is equipped with a precision cantilever stage, a krick bearing assembly, and an on-board DAGE MicroPlus Nano X-ray imaging system. Its features include high-resolution (250 μm) bond testing, higher accuracy die attach and die bond testing with 0.2% positional resolution and high repeatability of results, integrated precision x-ray imaging unit, real time control of force and displacement, and low cost per die attach / die bond test. The cantilever stage of DAGE 4000PXY bond tester is purposely designed for high-resolution testing and to ensure accurate repeatability by controlling the force and displacement. The maximum test area is 250 mm x 250 mm and can be programmed to work with all standardized adhesive materials, such as epoxies, rosin, silver epoxy and conductive paste. The cantilever stage is driven by a voice coil and controlled by an advanced servo controller, allowing for fast and reliable, repeatable results. The Krick bearing assembly of 4000 PXY is a precision bearing machine that can accurately move the cantilever stage in two perpendicular directions. The Krick bearing features a soft spring that provides a nearly perfect fit, ensuring maximum repeatability of results. The bearing assembly includes an optical encoder to measure the displacement and force of the cantilever stage and ensure accuracy. The MicroPlus Nano X-ray imaging tool integrated in 4000PXY Bond Tester can take high-resolution images of tested samples, enabling accelerated failure analysis and process optimization. The X-ray source offers up to 200-micron resolution, enabling test engineers to accurately observe and analyze the bonding and attachment condition of the sample. DAGE 4000 PXY Bond Tester is designed to meet the needs of a wide range of test requirements, with a cost per die attach / die bond test that is competitive in the market. The instrument helps to ensure accurate repeatability and is easy to operate, making it suitable for production testing and engineering. This cutting-edge bond tester is suitable for use in the semiconductor, medical device, automotive, and other industries.