Used DAGE 4000 PXY #9115427 for sale

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Manufacturer
DAGE
Model
4000 PXY
ID: 9115427
Vintage: 2004
Pull and shear tester BS250 Ball share cartridges Options: LEICA Stereo microscope or comparable unit WP100 Unit for pull testing BS5KG Unit for shear testing PC Operating system: Windows 7 2004 vintage.
DAGE 4000 PXY is a high performance, durable wire bonder designed for use in advanced assembly processes. The bonder is designed to provide consistent, precise bond locations and reliability, even in high-volume production runs. DAGE 4000PXY has an integrated camera equipment that offers both coarse and fine vision to ensure utmost accuracy in each bond. The bonder features three modes of operation - manual, semi-automated, and fully automated - to accommodate various user requirements. The efficient, automated wiring loop (AWL) controller used by the bonder allows it to quickly move between each sequential bonding site. 4000 PXY is equipped with a vacuum metallization system for pull and push bond applications. This unit utilizes a focused laser beam to uniformly deposit metal on the wire surface, ensuring each bond is as clean as possible. The bonder's robust vision machine can detect wire geometry and variable webbing quickly and accurately, allowing for quality control to cycle through each step of the assembly process. The bonder's intuitive software allows users to customize the wire bonding pathways, speeds, and cycle times. 4000PXY has a two-stage wire feeding tool that is designed to feed various wire sizes quickly and accurately. It also has an option for a two-axis motorized stage movement for bonded parts. This motorized configuration is designed to handle parts of various sizes and configurations. DAGE 4000 PXY has an advanced, but user-friendly, user interface and a top-of-the-line data logging station that can provide hotlinks to all production specs. The user interface is fully programmable and designed to provide users with a simple platform to set up and execute bonded processes. DAGE 4000PXY is ideal for applications ranging from medium to high volume bond production. Its lightweight design and advanced functions make it a great choice for any bonded process. It is reliable and easy to use, making it a favorite in the semiconductor market.
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