Used DAGE 4000 PXY #9121264 for sale

DAGE 4000 PXY is a high-end, fully automated wafer and chip bonder designed to maximize productivity and throughput. Featuring a large working area and a wide variety of bond types, it is ideal for a variety of industrial applications. This automated bonder offers superior accuracy and repeatability with its Ultrafine Pitch (UFP) XY drive equipment. It utilizes two computer-controlled, brushless servo motors to precisely move the bond head and substrate in different patterns. This ensures accurate movements and high-resolution bond control. The unit can bond with various types of wires, including gold, aluminum, and copper. The bonder also features a precision motion-control system, which allows for repeatable and accurate positioning and alignment. For optimal productivity, the bonder is equipped with a bonded wafer/labels/marker unit and a high-speed vision machine. The vision tool ensures accuracy by providing visual feedback on every bond. This allows the asset to detect and correct for any potential errors in real time. The bonded wafer/labels/marker model enables feature recognition, ensuring optimal output. The large working area and a large number of bond programs available on DAGE 4000PXY facilitates efficient and error-free bonding for various complex applications. It is designed to process a wide range of substrates and products. The unit also features an advanced bonding tool, which allows the user to adjust the power, current, and temperature of the bond in real time for maximum control and flexibility. With its high-end capabilities, 4000 PXY is perfect for manufacturing projects. Its accurate and repeatable operation allows for reliable results and shortens production cycles. It is also equipped with cutting-edge safety features, making it one of the safest automated bonders available on the market.