Used DAGE 4000 PXY #9124586 for sale

DAGE 4000 PXY is a precision bonder for high-volume wafer level packaging applications. It is designed to provide a consistent and reliable bonding process to meet a variety of customer requirements. The equipment incorporates four independent axes of motion, including two stages of high speed X-Y scanning, two stages of manual adjustment of z-axis travel as well as an additional fully automated stage of z-axis travel. DAGE 4000PXY features an integrated backside alignment capability for accurate placement of contact pads and other bond pads on the wafer. This is done using an advanced vision system that is both fully programmable and configurable. This unit is designed to quickly scan and identify the contact pads on the wafer in order to accurately align the bond pads of the bond head to the wafer. The machine can be used for a variety of wafer sizes and types, from small-scale flat wafers to large-scale flip chip and micro-BGA devices. For the bondhead, 4000 PXY offers a PEM300 gold/tin wedge bondhead, which ensures fast and accurate bonding of wire bonds and de-panelized die. This bondhead is designed to provide a precise and reliable bond process that helps to meet customers' requirements and deadlines. It also offers a high degree of controllability including a closed-loop force monitoring tool, automated tension adjustment, and adaptive tip height sensing. For accurate monitoring of the bond process, the asset features a vision inspection station. This model includes an advanced camera equipment that is used to view each step of the bonding process in detail. It is capable of verifying the alignment and presence of contact pads, wire bonds, and other aspects of the bond. The inspection is also used to ensure the integrity and quality of the bond prior to transfer to the packaging cycle. 4000PXY is designed to ensure consistent and reliable bonding processes. It offers advanced features and provides an accurate and reliable bond process even in high volume production environments. Its integrated vision system and bondhead provide the accuracy and precision needed for successful wafer level packaging applications.