Used DAGE 4000 PXY #9221240 for sale

DAGE 4000 PXY is a high performance ball bonder that is designed for use in a variety of microelectronic applications. This device is capable of producing wire bonds up to 40mil in diameter with extremely high accuracy, making it an ideal choice for those needing precise wire bonds. DAGE 4000PXY utilizes a state-of-the-art displacement control equipment (DCS). This system features the latest advances in beam alignment technology, allowing for full-flight control of the beam's accelerated speed, giving the user complete control over the bond quality. As a result, the device is able to produce precise wire bonds even when working with very small, delicate components. 4000 PXY can work with a variety of ball sizes including gold, copper, aluminum, and palladium. Additionally, it can also handle a variety of bond materials. This versatility makes it suitable for use in many diverse microelectronics applications. The device also features a high tech camera unit. This machine can be used to monitor the alignment of the beam, and to accurately measure the bond afterwards. As a result, the user can ensure that the bond is as accurate as possible. Additionally, the camera tool can also be used to troubleshoot any problems that might be encountered during the process. Overall, 4000PXY is an excellent choice for those requiring precision wire bonds for their microelectronics applications. It features a state-of-the-art displacement control asset for full flight control of the beam, a versatile range of ball sizes, and a high tech camera model for monitoring and troubleshooting. As result of these features, DAGE 4000 PXY is well suited for use in a variety of microelectronics applications.