Used DAGE 4000 PXY #9267410 for sale

DAGE 4000 PXY is a reliable, high performance bonder that offers outstanding flexibility and efficiency in die attach and packaging applications. This equipment operates with both lead-free and low-temperature solders, as well as a range of high temperature solders, including Pb-Sn. The PXY system is equipped with the industry-leading bond-head technology that ensures perfect placement accuracy and consistent bond quality for every single job. The PXY bonder is based on an advanced design with DAGE patented BondForce technology to ensure both quality and flexibility. The BondForce platform enabled the incorporation of a wide variety of bond-head technologies and with cutting-edge software, the unit can be configured for both manual and automated operation, depending on the application. The PXY bonder is ideal for pick-and-place, chip-on-board, and fine-pitch attach. It features a floating thermal head and dynamic vision machine for precise part alignment and solder deposition control for exceptional performance. Its vacuum vision tool ensures accurate placement and its patented BondBlaster makes sure that all solder joints are perfectly formed. The PXY bonder is equipped with automated die bonding and placement capability. It has a solder wave tank, along with an advanced mezzanine asset for efficient die-handling and placement throughput. The vacuum head is capable of picking up parts as small as 0201 and the solder jetting process can achieve an accuracy of 25 µm and up to a 233 mm2 area deposit. The PXY can easily be integrated with other stand-alone bonders and offers support for both manual and automated placed components, along with quick setup capability. With its high value-add precision, the PXY is a trusted model suitable for a range of applications, from fine pitch, to high frequency, and high-speed bonder.