Used DAGE 4000 PXY #9284076 for sale

DAGE 4000 PXY is a high performance wafer bonder designed for die attach applications. It features a work chamber that has been designed to provide maximum stability during bonding operations. The wafer stage is driven by advanced motorized stages that are capable of handling wafers up to 200mm in diameter. The machine offers a modular design that allows for quick and easy setup and operation. Dual needle-point translation stages provide simultaneous x- and y-axis displacement, allowing for accurate bonding of multiple dies. A separate vision system enables precise placement of small die, as well as defect inspection. Sub-micron feedback control for both linear and angular motions, ensures the accuracy of the die placement during the bonding process. Heat is implemented to form strong interconnects between the wafer and substrate, with a plate heater providing precise temperature control during bonding. The machine's software package allows for parsing and storing of data, as well as table-side registration control, to ensure that the template is accurately placed over the wafer. DAGE 4000PXY provides support for a wide range of adhesive materials, including commonly used fluxes. It is able to bond to a variety of substrates including silicon wafers, glass and ceramic substrates, and organic substrates. Furthermore, the machine can be configured to bond various die sizes, and can be used for die-to-die, die-to-substrate, and die-to-wire bonding operations. In addition, the machine is equipped with a drive-in/drive-out reticle holder for use in precision alignment and packaging processes. This provides for repeatable, accurate performance while keeping the process robust. The machine is designed to meet a variety of industrial requirements, minimizing the need for additional post bond processes. Overall, 4000 PXY is a reliable and powerful bonder system that provides excellent performance for a variety of die attach operations. It is equipped with advanced technology and software to ensure precise placement and bonding of wafers and dies, as well as a range of features to make it easier to use and maintain.