Used DAGE 4000 PXY #9284109 for sale

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DAGE 4000 PXY
Sold
Manufacturer
DAGE
Model
4000 PXY
ID: 9284109
Bond tester Does not include cartridge.
DAGE 4000 PXY is a state-of-the-art bonder designed for accurate and reliable bond production and repair. It is powered by an advanced processor that provides high resolution imaging and real-time analysis to quickly and accurately analyze bond information. The robust and versatile equipment features a modular design and a variety of optional accessories that make it suitable for a wide range of applications. DAGE 4000PXY features an adjustable X-Y stage, which allows for a range of bond sizes, and its small foot print makes it ideal for laboratory or small production environments. Its high accuracy positioning system provides a precision of as little as 10 microns for both placement and bond analysis, while the high-speed imaging unit makes it one of the fastest bonders available. The bonder also has a user interface that makes it easy to setup, operate, and monitor bond production and repair. The machine has an intuitive user interface, providing a wide range of parameters and commands for programming and monitoring bond operations. 4000 PXY also offers a number of dependable features such as auto-focus, dual bond sensors, vision-aided bond control, pre-programmed recipes, multiple bonding algorithms, and automatic reporting. The bonder is also designed to comply with the industry standards for safety and environmental concerns regarding the use of alternative bonding materials. The tool is certified to comply with UL and CE standards and is backed by a quality assurance warranty. 4000PXY is a reliable and accurate bonder that provides users with the capability to produce and repair a wide range of bonds quickly and efficiently. It offers a cost-effective solution for production and repair of small to medium-size bond applications, as it can easily be customized to meet any application specific needs. The user friendly interface and powerful processor provide a reliable basis for both bond production and repair operations.
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