Used DAGE 4000 Series #9309668 for sale

DAGE 4000 Series
Manufacturer
DAGE
Model
4000 Series
ID: 9309668
Pull tester.
DAGE 4000 Series is a revolutionary range of wire bonders which have revolutionized the way bonding processes are carried out. This revolutionary system offers multiple automation features as well as a high degree of repeatability and reproducibility for production in high-volume technologies such as Multi-Chip Modules (MCMs). The advanced, flexible system offers both standard and advanced features such as a standard metrology station, 3 ball placement platforms, Wire Wizard Graphical User Interface (GUI), advanced wedge style ball bonding, and advanced capillary and needle styles. It also offers advanced features such as auto-focus, auto-correct, and auto-process to increase user efficiency. While a maximum of three bonding positions can be used simultaneously, a maximum of three bonders can be employed at any one time. 4000 Series utilizes an advanced high-precision vision system and a wide range of bond heads and capacitor placers. It also features a feedback loop for temperature and pressure control, as well as a more accurate bond process with multiple micro-positioners. This ensures that the bonding process is precise and result in flawless, dependable devices every time. DAGE 4000 Series also offers a multi-grid mode, which allows a single operation to bond multiple grids in simultaneous shots. This helps to minimize the cycle time and reduce costs associated with multiple machines. In addition, 4000 Series offers a wide range of actuators and bond head selections to accommodate all wire bond types and makes it possible to bond a great variety of materials and assemble a wide range of packages. With a maximum Gold Pull force of 70g and a Gold Migrate force of up to 50g, DAGE 4000 Series is built to accommodate heavy materials and sophisticated engineering requirements. Its capillary and needle style recognitions give users the capability to bond almost any type of device, and its automated features make for efficient, reliable bond processing.
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