Used DAGE 4000 TP #9246969 for sale

DAGE 4000 TP is a high precision, thermal fusion bonder for use in the interconnection of silicon and other semiconductor components. It is suitable for a variety of applications, including fabrication of 3D stacking, advanced packaging and wafer-level rework. This advanced bonding equipment offers a patented high-density array of thermal fusion points, an optical alignment system, and a built-in web camera for detailed monitoring and control. It is equipped with a high-speed linear motor for rapid, precise motion, and provides repeatable precision of 0.1 um. 4000 TP is a cost-effective solution that enables interconnects at minimum pitch with minimum space. It offers superior metrology capabilities, with the ability to measure and scan line, pad, and feature size, critical for accurate bonding. It is capable of testing and measuring the contact and thermal steel bond integrity, utilizing sophisticated automation to ensure metallurgical integrity throughout the process. The unit is designed for long-term, reliable operation, with a comprehensive suite of thermal management and control functions, including a proprietary data-driven thermal fusion machine for optimized performance. It is also equipped with an intuitive human-machine interface (HMI) and offers a wide range of customizable protection features for safe and reliable operation. In addition, the tool has a unique onboard diagnostics feature that enables real-time evaluation of machine performance. It is also compatible with secure remote database as well as various industry standard tools for rapid viewing and storage of bond quality data. DAGE 4000 TP is a feature-rich solution for automated and cost-effective semiconductor bonding, designed to bring long-term value to manufacturers.