Used DAGE 4000 TP #9316498 for sale

DAGE 4000 TP is a large area, fully automated, ultra-high resolution wire bonder designed for the mass production of complex, high density, and large scale packages. The equipment features a cutting edge user interface and a proprietary graphical operating software platform. The system provides automatic alignment, accurate optical recognition, and a repeatable high accuracy bonding process. The machine is capable of handling up to four different wire thicknesses, and the bonder is controlled by a programmable logic controller (PLC). 4000 TP is ideal for low contact resistance to a wide range of contact surfaces including gold, aluminum, nickel, and silver. Its unique adjustable laser vision alignment unit offers speed, precision and control. The machine also offers high speed wetting and die attach operations. Its servo-controlled drive tool provides precise and repeatable movements, allowing for precision placement and accuracy in bond formation. The asset offers a wide range of temperature control, ranging from 80°C to 400°C. The machine can be programmed with the company's proprietary software, meaning it is able to accommodate the most demanding applications and bond configurations. The machine is equipped with an efficient heating element assembly and an efficient cooling process to ensure consistency and reliability. The 4000 series bonding model is designed to meet the requirements of high speed and reliable production. It is highly reliable, accurate and easy to program. The machine offers cycle times of up to 10 seconds and is designed to meet the most stringent requirements of safety and reliability. The equipment is also compatible with a variety of on-board fixtures, which are available upon request. DAGE 4000 TP provides reduced maintenance effort by incorporating the industry's best user friendly features. The machine features a zero-error bonder, an integrated recipe database, and a programmable parameter set. The system incorporates conversational programming capabilities, a simple to use touchscreen, and a number of security features. The bonder is compliant to RoHS and EMC standards and is qualified for critical applications.