Used DAGE 4000 #293586509 for sale

DAGE 4000 is an advanced die attach bonder that is used for the die bonding process of electronic components. The machine has a vision system for precise inspection of parts and for quality assurance of the parts during the bonding process. 4000 is designed with a CCD camera which is used for vision inspection during the die-attach process. The CCD camera is closely coupled with robotic device to minimize the risk of contamination during the attachment process. The machine is equipped with a HeNe laser for the alignment of the die before bonding. The HeNe laser is used to measure the distance between the die and the substrate, by reading the reflection and resonance of the laser beam. The machine is capable of soldering, wedge bonding, press-fit and flip chip, as well as hybrid bonding (mix of soldering and wedge bonding). The accuracy of the equipment is 0.01mm and accommodates a wide range of Die sizes. The speed and accuracy of the die attach process is further improved by the ultra-precision positioning mechanism that DAGE 4000 has. The machine utilizes a special Low Force Technology (LFT) to reduce mechanical stress on the die and to ensure a better bond. The fine-tune program is capable of setting up two different process times for the Bonding Head and the Hot Plate, to enable quicker and better bonding. The motion commands are controlled by a DXF/antec CAD programming language, which allows for precise alignment of die during the bonding process. 4000 is equipped with the latest safety measures and rules that are enforced in the bonding environment. DAGE 4000 is ideal for production environments and is capable of producing high quality results with minimal operator involvement. The machine has also proved to be reliable in harsh industrial environment and is capable of producing high quality reliable bonds.