Used DAGE 4000 #293642503 for sale

DAGE 4000 is a versatile and high-performance bonder equipment. It is used for diebond, wirebond and flipchip processes for a variety of electronics manufacturing applications. 4000 offers precision and accuracy to the highest standards. DAGE 4000 utilizes advanced 5-axis motion and vibration isolation systems for perfect accuracy in alignment and placement. The intuitive user interface allows for easy operation by both trained and non-technical personnel. The system features precise and independent X, Y, and Z stages that offer precise tooling and motion control capabilities. Advanced motion optics provide vision and motion capabilities that ensure precise die selection, positioning and bonding. The unit is also equipped with advanced auto-disable functions, allowing the machine to automatically stop and disable itself if normal operating parameters are not maintained. It has multiple process capabilities including wirebond, diebond and flipchip to ensure that all of your application requirements can be met with one single tool. The tool also offers high speed and repeatability with the bonded parts being placed accurately and repeatably up to 60 microns, making it suitable for use in critical industrial applications. Advanced diagnostics and error-checking features are also included which allow for quick root cause analysis and resolution of faults and problems. In addition, 4000 features automated and adjustable user-controlled process parameter presets for easier setup and repeatability. The process parameters are monitored and controlled using a quality management asset for additional control. The model also contains a comprehensive library of standard connectwire and die formation recipes for specific processes. DAGE 4000 is an excellent choice for the production of complex structures and assemblies for a variety of applications. The 5-axis, high-speed, and accuracy make it an ideal equipment for high volume assembly and packaging processes. The intuitive user interface and robust diagnostics capabilities provide an all-in-one integrated bonding solution, ensuring dependable and reliable results.