Used DAGE 4000 #293819783 for sale

Manufacturer
DAGE
Model
4000
ID: 293819783
Bond tester.
DAGE 4000 is a revolutionary piece of microelectronics bonding equipment. This high-end equipment is designed to increase the reliability, accuracy, and speed of the microelectronics production process. 4000 is equipped with advanced technologies that enable more consistent, error-free bonding of devices. The system utilizes an advanced digital imaging unit to accurately measure and manipulate the shape and size of the device during the bonding procedure. This allows the machine to achieve higher accuracy, while preserving the integrity of the bond. The digital control of the imaging tool also allows for higher levels of repeatability and the ability to quickly adjust the parameters for any particular application. DAGE 4000 also features a state-of-the-art force monitor, which allows for precise control of the amount of force applied during each bonding cycle and prevents contamination of the bond by measuring the maximum force allowed for a given bond. As a result, the bond is consistently strong and reliable. The asset also utilizes a proprietary, laser-based micro-welding model to form the strongest possible bond between the device and the substrate. 4000 is designed to increase the speed and accuracy of the microelectronics production process by utilizing a fully integrated heating, cooling and thermal mass equipment. This system ensures the necessary thermal conditions during bonding cycles in order to achieve reliable, repeatable performance. The unit also includes an automated convection and pressure machine which allows for the even distribution of heat during the bonding process. Lastly, DAGE 4000 contains a range of software tools and components that enable robust operation, while minimizing setup time and user intervention. These advanced tools and software enable the tool to operate in any environment, and make it easy to integrate the asset into any existing production line. In summary, 4000 presents a state-of-the-art solution for precision microelectronics bonding. With its integrated heating, cooling, and thermal mass systems, advanced digital imaging and laser welding systems, and a range ofsoftware features, DAGE 4000 provides reliable, repeatable performance that increases the efficiency and accuracy of the production process.
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