Used DAGE 4000 #9083481 for sale

DAGE 4000 is a highly advanced wafer level direct bond interconnect equipment designed and manufactured by DAGE Precision Industries. This system is capable of bonding a wide range of materials including Si, oxides, polyimides, BPSG, and many others. 4000 uses advanced imaging, precise temperature control, and a standard digital output interface to provide a state-of-the-art solution for producing so-called chip-scale packaging. The unit works by using a laser image projection machine to align the substrate side of the device during the bonding process. The substrate is then heated by means of an IR laser, which causes the solder or adhesive material to reflow onto the substrate. The process is carried out in a clean environment, since the parts never come into contact with the atmosphere, which prevents contamination. The temperature of the tool is controlled using a temperature controller, which is designed to maintain a precisely set temperature. This ensures that all of the components, such as the substrate and the solder, remain consistent during the bonding process. This helps to eliminate variability in the bonds, leading to increased adhesive strength. DAGE 4000 also features an advanced digital output interface which allows for the collection of real-time data. This data can be used to monitor the status of the process and to make adjustments if needed. The data can also be used for analysis and process improvement. 4000 is an incredibly powerful and versatile asset that offers numerous advantages over traditional bonding methods. Its precise temperature control, alignment capabilities, and integrated digital output interface allow for chip-scale packaging that exceeds industry standards. With its ability to produce high-quality bonds at minimal cost, DAGE 4000 is an ideal solution for high-volume chip-level packaging needs.