Used DAGE 4000 #9122493 for sale
URL successfully copied!
DAGE 4000 bonder is a high-end bonding machine used across a broad range of industries for bonding this sensitive and delicate components. It features a precision feeder and comprises a steady X-Y movement platform. The user can manually control the X-Y movement platform to precisely control the size of the bond and ensure it is accurately placed. It can be used to bond conductive adhesive, silver epoxy, solder paste and a variety of other materials to various substrates and components. The machine is especially designed to handle the intricate processes needed for bonding fine, fragile components and substrates. 4000 is equipped with two independent process zones that are used to apply the bond. This enables the machine to apply the bond material in two different locations at the same time. Additionally, the machine has a vision feeder that is used to monitor and control each step of the process. This ensures that the process is properly applied each and every time. DAGE 4000 also comes with a temperature control station and air supply system for precise temperature control and uniformity. The temperature control station is used to accurately monitor the temperature of the process area, while the air supply system is used to adjust the air pressure in the process area. 4000 also features a humidity sensor that is used to monitor the humidity level in the process area. This ensures that the environment in which the bonding process takes place is always properly regulated. DAGE 4000 is also designed with a user friendly interface that allows the user to configure their machine to meet their exact bonding needs. It comes with an instructional manual that clearly explains all the aspects of the machine and how to best use it. Overall, 4000 is a high-quality bonding machine used across many industries for bonding sensitive and delicate components. It has great precision, accuracy, uniformity, and user-friendly features that make it an ideal choice for a variety of bonding needs.
There are no reviews yet