Used DAGE 4000 #9138231 for sale

DAGE 4000 is a bonder designed for fully-automated ball-bonding processes. It is used in the semiconductor and electronics industries and offers an extensive range of features for a wide variety of bonding applications. It is a high-end bonder with a broad capability and outstanding precision and accuracy. 4000 has an advanced XY-Z bondhead and can facilitate the bonding of wires ranging from 0.12mm up to 0.50mm in diameter. The tool is perfect for bonding fine pitch components, MEMS and microchips in a highly accurate and reproducible manner. The advanced bondhead, capable of rotating 360 degrees, is designed to provide a repeatable and consistent bond bead formation. The advanced control system on DAGE 4000 includes an innovative ribbon feed, cycle time monitor and automatic Stitchout that ensures the highest levels of accuracy and precision for each bond. Additionally, the bonder provides an unmatched level of accuracy and repeatability through the application of continuous feedback to regulate the wire loop and bond head feed rate. It also includes a precision vision system that enables operators to optically verify bond formation and ensure integrity of the bond process. 4000 is also capable of ultrasonic and thermosonic ball-bonding, bonding wire materials such as gold, copper and aluminum alloys. Its unique algorithms and advanced features ensures stable and consistent wire looping, as well as the ability to switch wire materials with minimal down time. The bonder also includes advanced monitoring capabilities. The innovative monitoring system on DAGE 4000 is designed to detect wire breakage, insufficient wire looping, incorrect wire loop position, incorrect looping direction, and incorrect looping fence positions during the Bonding Process. Overall, 4000 is a state-of-the-art automated ball-bonding tool designed for high-precision densely packed assembly operations. It is equipped with advanced features and functions to deliver the desired results in a highly reliable manner. The bonder also ensures process repeatability and high reliability, allowing for consistent and accurate wire bond formation.