Used DAGE 4000 #9157576 for sale

DAGE 4000 is a high-performance bonder designed for use in a variety of applications, including semiconductor manufacturing and industrial processes. It is a versatile, highly automated equipment that provides reliable and repeatable bonding results. 4000 is a multi-station, driven bonder with a highly configurable, modular design. The system features up to four independent ultrasonic, epoxy, or wedge bonders, allowing operators to handle both complex and simple applications. It is also compatible with a wide range of media, from materials of varying thickness and die designs to substrates. DAGE 4000 offers an advanced motion unit. The bonder is designed to adjust to varying lengths of both abutment media and die sizes, allowing for optimized bonding performance. It is also designed with high-accuracy linear drives and open frame design, allowing for improved tool accuracy and reduced overhang loads. 4000 is easy to use and intuitive, with its Human Machine Interface (HMI) touch screen. It also accommodates multiple languages, allowing operators to set up and perform tasks quickly and efficiently. The HMI also includes multiple diagnostic tools, allowing operators to monitor and adjust the bonder's process easily and accurately. DAGE 4000 is a powerful bonder capable of producing efficient, reliable, and repeatable results. Its modularity and flexibility makes it suitable for a wide range of applications, while its advanced motion machine ensures repeatable and accurate results. The HMI is easy to use and intuitive, allowing operators to quickly and accurately perform tasks and view diagnostics. 4000 is an ideal solution for semiconductor manufacturing and industrial processes where accuracy, consistency, and reliability are key.