Used DAGE 4000 #9166915 for sale

DAGE 4000 is a fully automated, medium-to-high volume flip chip bonder, designed for a wide range of applications and production needs. It is capable of producing wafer-level chip-scale packaging as well as flip-chip assemblies for use in consumer, industrial and military/space applications, making it a versatile and robust choice for demanding production environments. 4000 is equipped with a highly accurate, fully automatic die bonder with a high speed, single-pass die attach capability. This enables high throughput while maintaining tight positional accuracy and excellent process repeatability. The die bonder is capable of both adhesive and solder die attach, allowing a wide range of materials to be used. The semiconductor package to substrate bonding is handled by the integrated auto-bonding tool, allowing precise and reliable placement of chip-scale packages. The auto-bonding tool's non-contact, non-destructive bonder and reader technology further improve the accuracy and repeatability of positioning. DAGE 4000 is fitted with an advanced, optical vision equipment that is used for die and package positioning in order to improve accuracy. The system is capable of accurately placing die and packages over large area substrates up to 200mm x 200mm. The vision unit is also used for in process quality control to ensure all components are correctly placed, as well as for wafer-level repair during the production process. 4000 can be further customized for specific production needs with a range of process tooling options available. These include bonding wire tooling, pick & place tooling for ICs and other components, and tools for dicing and marking substrates. These tools enable a variety of production solutions and processes depending on customer requirements. In addition to its integrated hardware, DAGE 4000 is designed to be automated and user-friendly, allowing flexibility in terms of production setup. It is equipped with an intuitive user interface that enables parameters and processes to be easily set up and monitored in real-time, streamlining production and reducing labor costs. The machine can integrate with other software and equipment to make it a versatile, cost-effective solution for many different production environments.