Used DAGE 4000 #9186849 for sale

DAGE 4000 is an advanced bonder capable of wire and die attach processes. It is ideal for medium to high-volume production of electronic assemblies as it offers both speed and precision. The bonder is equipped with an integrated vision system, providing highly accurate registration and alignment of components. A pneumatic-pressure platform ensures secure gripping for a variety of components sizes. 4000 is designed for wire bonding with gold, aluminum and copper wire materials. It is suitable for both fine- and ultra-fine-wire applications, allowing for wirebond material diameters ranging from 0.05mm to 0.3mm, and bonding forces of up to 500g. The wire is driven by a pneumatic system, which ensures a consistent and repeatable bond process. The bonder is fitted with an integrated die attach module, designed for die removal and chip attachment to substrates. It is capable of handling die sizes of up to 5 x 5 mm and features a pre-heat function for optimal die-to-substrate adhesion. The micro-pancake die bonder comes with a large variety of nozzles, plates and bond heads, which makes it suitable for various types of substrates and components. Manufactured from stainless steel, the bonder offers enhanced vibration dampening, improving the accuracy and repeatability of the process. For process monitoring and maintenance, DAGE 4000 provides thermal imaging and analytic data on all performed bond operations. The bonder is user-friendly, accommodating two-handed operation and a graphical user interface. It also comes with a variety of software upgrades, allowing users to incorporate new functions into the process quickly and easily.