Used DAGE 4000 #91954 for sale

DAGE 4000 is a state-of-the-art wire bonder designed to meet the growing needs of advanced microelectronic packaging and semiconductor applications. With its versatility and robust performance, 4000 is ideal for prototyping and production. Capabilities include die bonding, wedge, and ball bonding up to 4 mil gold wire in a wide range of substrates and packages. The device has exceptional process repeatability and features a high-speed, multi-axis motion system for greater accuracy and throughput. The easy-to-use user interface provides intuitive guidance, so that even novice engineers can quickly become familiar with the software and quickly set up and optimize the machine to process a wide range of components. The automated optical systems allow material recognition and misalignment detection, while the advanced process capabilities offer exceptional bond strength and excellent bond integrity. With its multiple tooling options, DAGE 4000 is capable of bonding fine bond wires with or without insulation and in tight pitch configurations for use in FC packages. Its advanced process monitoring and control features also allow for bond verification to ensure reliable operations. Whether for prototyping or production, 4000 is equipped with the tools and features to help you achieve and exceed your bonding goals.