Used DAGE 4000 #9213595 for sale

DAGE 4000 is a fully automated precision bonder designed for a variety of applications across the electronics and semiconductor industry. It utilizes a unique two-bed platform that allows for both thermocompression and thermosonic bonding cycles. This platform works in combination with the innovative Advanced Power Control (APC) equipment to ensure repeatable adhesion of complex scenarios. During thermocompression, the upper and lower platens of the two-bed platform are pressed onto the component and the temperature of the platen is precisely controlled via thermal cycles. Thermosonic bonding works by inducing an ultrasonic or mechanical vibration of the component taps, fillets and leads. 4000 has a bonding area of 300 x 300 millimeters and can handle components as small as a 1.4 millimeter lead pitch. Its integrated Advanced Vision System (AVS) ensures quality assurance during the bonding process. The AVS is a fully automatic unit that provides precision alignment of components and accurately inspects the bond quality. For accuracy and repeatability, DAGE 4000 can simultaneously operate multiple axes such as tilt, rotation and conveyor motion. The tilt functionality increases bond accuracy and tightness between the component and substrate surfaces. 4000 has a range of cycle times depending on the application and alloy. The average bonding time for a single-point bond is 1.5 to 3.5 seconds. Its superior repeatability produces consistently good bonds over a wide range of lead sizes and pitches. In addition, its proximity shuttle ensures a high throughput by reducing non-production time. The combination of its two-bed platform, APC machine, AVS and proximity shuttle makes DAGE 4000 the perfect bonder for electronics and semiconductor applications. With its robust design and operation control systems, 4000 ensures the production of high quality and reliable bonds in a variety of applications.