Used DAGE 4000 #9243736 for sale

DAGE 4000
Manufacturer
DAGE
Model
4000
ID: 9243736
Wafer Size: 8"
Vintage: 2012
Bond tester, 8" 2012 vintage.
DAGE 4000 is a state-of-the-art bonder specifically designed for high-performance, high-volume microelectronics bonding applications. The system can handle a wide variety of complex substrate configurations including semiconductor, flat panel, and flex circuit assembly, among others. The bonder features advanced bondhead technology, providing optimal control and stability in the bonding process. The bond head includes modulated ultrasonics as well as an array of transducers for fine control of the bond geometry. Additionally, the bond head is designed for independent temperature control at each bonding point, which eliminates hot spots. The bond assembly process is further enhanced with 4000's direct interface to an automated substrate loader which can quickly transfer the assembly substrates to the bondhead. This automated substrate loading significantly reduces both the possibility for contamination and the chance for human error. The bonder also features a dynamic control system that is designed to dynamically adjust the process parameters in order to optimize the productivity of the bond assembly. This allows for a very rapid cycle time, up to 7200 bonds per hour in some configurations. DAGE 4000 is also very easy to use, with a touch screen user interface and an extensive library of recipes that can be used to develop the optimal bond process for any given application. In addition to its excellent performance, efficiency, and flexibility, 4000 provides an exceptionally safe bonding process. The lasers used in the process are tightly sealed to protect personnel from coming in contact with them, and the machine is also designed with safety interlocks to ensure that only authorized personnel can access the process area. Overall, DAGE 4000 is an excellent choice for high-performance, high-volume microelectronics bonding applications. Its advanced bondhead technology, automated substrate loading, dynamic process control, user-friendly interface, and safety features make it an ideal choice for today's most demanding applications.
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