Used DAGE 4000 #9247997 for sale

Manufacturer
DAGE
Model
4000
ID: 9247997
Ball shear tester Shear: 5 kg NIKON SMZ 45 Microscope With PC Operating system: Windows XP Manual included No work holder Input voltage: 115 V.
DAGE 4000 is a high-performance, precision bonder that boasts a number of features that make it one of the most powerful, reliable and versatile bonders on the market. Suitable for a range of bonding and sealing operations, 4000 provides superior bonding of substrates with a wide range of surface finishes, from sapphire to ceramics, with a broad selection of adhesives. The core of the bonder is its advanced dual-zone heating equipment that provides precise temperature control over each of the two bonding surfaces. This system ensures both zones are heated independently to their pre-programmed temperatures with a high degree of accuracy and stability. It also enables the quick and easy heating of each zone right up to temperatures of up to 480°C. This precise heating of the bonding surfaces is combined with precise dispenses of acrylics, tacky flux, polyimides and other adhesive that can all be pressurized to ensure controlled and uniform spreads. Additionally, DAGE 4000 can accept a range of nozzle sizes to ensure the perfect dispensing rate for any application. 4000 can handle just about any substrate size and shape, as well as a wide range of lead frames, IC packages, hybrids and uneven surfaces with its highly responsive XY servo motion unit. This motion machine allows for the substrates to be accurately aligned and positioned before the adhesives are dispensed. The bonder also features integrated vision systems that can be used to inspect each substrate for size, shape, bonding material and general quality. This automated inspection capability can save significant amounts of time and labour, as well as increase overall quality and yield. DAGE 4000 is an essential tool for any production, and its features make it one of the best bonders available. It can be used in a variety of applications, from the highest precision robotics and IC packaging, to discrete parts assembly. It is robust, reliable and provides excellent performance for all the bonding operations it performs.
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