Used DAGE 4000 #9255194 for sale

DAGE 4000 is a fully automated die bonding equipment that offers fast, accurate, and reliable interconnect solutions. It combines state-of-the-art motion control with optimized bondhead design to provide unmatched throughput and flexibility. The system is equipped with a high resolution vision unit to verify accurate position of component to ensure proper die placement. 4000 uses a laser diode to heat the leads, which in turn melts the gold or silver/tin alloy. After the bonds have been formed, the natural cooling of the leads provide the desired bonding strength. The machine is designed for assembly of flip chip devices, die carriers, and ceramic substrates. Heaters and temperature control devices allow for accurate temperature selection for each substrate. This ensures high yields and reliable performance. The vision tool used in DAGE 4000 allows for accurate die placement and reduces placement errors. A camera monitors the component location and position throughout the process, allowing operators to control the entire process and resulting in high yields and yields with minimal defects. The asset also features automatic compensation for part-to-part variations and promotes consistent repeatable results. The model's advanced features along with its autonomous programming allow for quick set-up and operation, allowing for process optimization in the shortest of time. The equipment is complemented by a user friendly operator interface which allows the operator to perform various functions such as calibration, changing settings, and monitoring system parameters. Up to four different jobs can be stored on the unit's memory. The combination of speed, accuracy and versatility makes 4000 ideal for both advanced and large scale production applications.