Used DAGE 4000 #9267276 for sale

DAGE 4000 is an ultra-precision wafer bonder designed to enable efficient processing of semiconductor components. With its patented 'Smooth-Move' direct-drive stage system, 4000 provides exceptionally fast and precise alignment of wafers, resulting in consistent and reliable bond quality. The bonder utilizes innovative technology to maintain sub-micron registration and can accommodate wafer sizes up to six inches in diameter. DAGE 4000 utilizes a state-of-the-art high vacuum system capable of reaching 10-6 Torr, providing a reliable environment for ideal wafer placement and bonding. The bonder uses one micron repeatability stages and encoder-based feedback for precision alignment, allowing for high accuracy and repeatability for each wafer. It also features a powerful bonding head with an integrated heater and Z-axis motion for accurate programming and control. To improve precision and performance, 4000 offers a variety of useful enhancements such as image registration, automatic surface roughness detection, and auto-focus. For temperature control, the bonder includes a proprietary hot-wall vacuum chuck featuring advanced thermal management to facilitate homogenous heat transfer and uniform bond line temperature throughout the wafer. The machine's software interface supports both local and remote operation, allowing for easy communication between the operator and the bonder. The software also contains a variety of helpful tools to ensure accuracy and consistent wafer to wafer performance. The interface provides graphical views of the wafer placement algorithms, as well as parametric control over many of the bonding parameters, enabling easy fine-tuning to optimize the process. In addition, DAGE 4000 comes with an array of servo motors that enable full range of motion operation across all six axes of the bonder. This allows for complex surface contouring and can maximize bond line control without sacrificing speed or accuracy. The motors also provide a reliable dynamic feedback loop for enhanced motion stability and thermal management. 4000 provides an outstanding combination of features, allowing for superior bond quality and enhanced bonding capability for a variety of semiconductor devices. Its advanced software and hardware make it a must-have for any semiconductor production line that expects consistently high-quality results.