Used DAGE 4000 #9277314 for sale

DAGE 4000 is an advanced ball bonder designed to meet the needs of today's demanding and rapidly changing production environment. The ball bonder is an automated equipment with a flexible robotic head that is capable of handling delicate wires ranging in size from 0.020" to 0.046". 4000 is equipped with a fully integrated vision system for precise placement of epoxy and wire bonds. The unit includes an in-line process monitoring and control panel, which features a host of functions allowing the user to customize the bonder to their exacting requirements. The machine also features a unique integrated double flux control feature for a specialized bonding process. DAGE 4000 utilizes a brand-new high-resolution camera for accurate alignment of the bond pads and a radial monitoring tool to protect far-side wires from damage. The asset also features a high-precision motorized rotation mechanism that rotates the gold wire in order to ensure perfect joining of the wires and pads. The model also offers advanced testing capabilities, such as automated thermal shock, tensile strength, and pull strength tests. 4000 is capable of bonding per IPC-4562, IPC-4551, and MIL-STD-883 standards, making it one of the most versatile bonders on the market. With its highly precise ball size precision, DAGE 4000 is one of the most accurate ball bonders available. The automatic end-of-cycle cleaning and the fact that the bond pieces can be operated in any order makes the equipment highly efficient and reliable. 4000 is an ideal choice for improvements in production yield and quality, and is an indispensable tool for today's semiconductor industry.