Used DAGE 4000 #9277844 for sale

DAGE 4000 is a fully automated, state of the art ball bonder designed for use in semiconductor production. It offers high precision, speed, and repeatability with a set of versatile features. The robust design of the machine enables execution of the most challenging applications and its integrated software solutions provide easily configurable process recipes. 4000 utilizes a robotic arm for precision placement of the bonding wires. It is capable of moving with speeds up to 5 millimeters per second, and with 1 micron repeatability precision. The programmable pick-up head is provided with 2 cameras for precise alignment and tension control. Magnetic grippers are used to hold the component in place for accurate bonding. It's capable of handling components with chip sizes up to 12 x 6mm and up to 200µm wire. The ball bonder can program automatic wire preforms in contact mode, loop shapes, and back side shear mode operations. The loop can be configured with multiple heights and diameters to provide for a wide range of applications. The system can also be operated in manual mode to further accommodate a range of operations. DAGE 4000 features a high speed imaging system that takes three high-resolution images of the bond while creating an observation log for statistical analysis. This log allows for auditing of production and contributes to the improved accuracy of its process control algorithms. The bonding process is highly automated and requires minimal set up time. It is designed with a user-friendly interface and controlled by an easy to use touch screen. The system also saves all of its settings and processes in a well-defined set of control parameters. Overall, 4000 is an advanced, versatile, and reliable ball bonder. It features precise speed and repeatability, as well as configurable process recipes, allowing for tasks to be completed quickly and accurately. As such, it is an essential part of any semiconductor production line.