Used DAGE 4000 #9307668 for sale

DAGE 4000 is a high performance die bonder developed by DAGE Group. This equipment offers precision die placement, accurate bond quality, and user-defined bond process profiles. 4000 utilizes advanced optical video microscope alignment technology for precise die placement, enabling the machine to obtain a die-to-die accuracy of +0.01mm over a full wafer. It also features thermosonic wedge and thermocompression ball bond capabilities to ensure the highest bond quality. The system features an 8-axis motion unit designed to maximize efficiency and provide a greater range of motion. It features a two-axis wafer motor and a six-axis die-handling robot, allowing for easy loading, precise die placement, and accurate bond registration. The advancedXYZ translation stages provide high speed performance and accuracy over a large working area. DAGE 4000 comes with an intuitive Windows user interface, enabling users to create and edit their own bond process profiles. The machine also has a number of advanced features, such as a spooler-timer for quick start/stop of the bond process, an operator-controlled lid with adjustable height, and a dual-vacuum tool for increased bond quality. The asset offers both automatic and manual bonding modes, providing users with the ultimate flexibility and control. 4000 comes fully equipped with an integrated high-resolution digital camera and a programmable exposure time. The model also features filmless/digital imaging for complete traceability, Pb-Free soldering capability, and an advanced external client based control equipment for remote monitoring and operation. DAGE 4000 is a reliable and cost-effective die bonder, designed to deliver superior bond quality and advanced macro management. It is capable of operating with a broad range of substrate and die sizes, making it an ideal solution for high volume production and research and development processes.